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AG TERMOPASTY Lead-Free Solder Paste – Sn96.5Ag3Cu0.5, Syringe 6g AG TERMOPASTY Lead-Free Solder Paste – Sn96.5Ag3Cu0.5, Syringe 6g High-quality lead-free solder paste from AG TERMOPASTY, ideal for precision electronics soldering. Comes in a 6g syringe with halide-free, no-clean REL0 flux. Offers stable and reliable joints with Sn96.5Ag3Cu0.5 alloy composition and a grain size of 25–45µm. Technical Specifications Manufacturer: AG TERMOPASTY Type: Solder paste Form: Paste Package: Syringe Alloy Composition: Sn96.5Ag3Cu0.5 Grain Size: 25–45µm Binder Weight: 6g Melting Point: 217°C Flux Type: Halide-free, No Clean, REL0 Flux Content: 12% Residues: Transparent, non-corrosive, do not require cleaning GHS Signal Word: Warning Hazard Statement: H317: May cause an allergic skin reaction. Version: For soft soldering Gross Weight: 23.1 g Storage Instructions Caution: Store at approximately 8°C to maintain paste quality. Agent Features Lead-free composition Residues are non-corrosive and transparent Can be cleaned with alcohol-based agents if needed No cleaning required after soldering Precautionary Statements P261: Avoid breathing dust/fume/gas/mist/vapours/spray. P280: Wear protective gloves/protective clothing/eye protection/face protection. P333 + P313: If skin irritation or rash occurs: Get medical advice/attention. P362: Take off contaminated clothing and wash before reuse. P501: Dispose of contents/container in accordance with local regulations. GHS Classification GHS07: Skin sensitisation, eye irritation, acute toxicity GHS01–GHS09: Not applicable to this product (standard hazard classes listed for reference)